Hardware Design Expertise

Area	Expertise
Microprocessor Architectures	ARM Cortex-A7, A8, A9, A15, A53, A72; ARM Cortex-M0, M0+, M3, M4, M7; 8 and 16-bit microcontrollers
Circuitries and Interfaces	Power: Power management; Reverse voltage protection; ESD and transient protection; Power Isolation; Power over Ethernet; Design for Industrial Applications which require high product quality and system reliability. Memory and Storage: SSD, SATA, Nor-Flash, Nand-Flash, SPI-Flash, SDRAM, DDR4, SD/SDIO/MMC Multimedia: Audio, Video, Camera HMI: LCD, MIPI, CSI, LVDS, HDMI, DVI Connectivity: USB, Ethernet, CAN, Bluetooth, WiFi, PCle, SATA Serial: UART, SPI, I2C GPIO, A/D, D/A, and analog Sensors: magnetometers; Accelerometers; IR-thermopiles; humidity, light and other sensors Embedded Vision: CMOS sensors and other digital camera technology
Schematic Capture	Low EMI Design Advanced Power management Junction temperature sensing and thermal management
PCB Layout	Mixed speed and signal technology High-speed digital and analog design Low EMI/RFI design μBGA, dual-die, fine pitch, PoP (package-on-package), microvias PCB technology, passive components as small as 01005 inch (0402 metric) packaging Power rail separation, Power over Hours (PoH) analysis High-density, multi-layer (12+), small form factor PCBs Signal integrity analysis 3D modeling
Design Tools	Cadence (OrCAD Capture and Allegro) Altium Designer/Protel SolidWorks 3D Re-usable schematic blocks, including layout stack-ups, to accelerate hardware design
In-House Engineering and Manufacturing Symbiosis	Design for Manufacturability (DfM) and Design for Test (DfT) optimization through close engineering and manufacturing collaboration Component engineers select materials according to DfM principles, longevity, availability, reliability, cost, process and supply chain considerations Rapid Prototyping, Customization, Design Iterations
Extensive Design Verification	Voltage, Current, Power, Timing, Signal Integrity and EMI Measurement Functional Operation Temp Chamber Stability Testing PCBA Microsection Analysis including PCB stack-up, solder mask and cross sectional metallographic and microscopic examination Stress testing for revealing of product failure modes Radiated Emission, Conducted Emissions and Radiated Immunity Testing in compliance with FCC Part 15, EN55011, EN55022, CISPR11, CISPR22, and CISPR32
Test	Hardware design practices that incorporate testability features in PCBA design: JTAG, voltage, current, and signal test points