Hardware Design Expertise

  Area   Expertise
Microprocessor Architectures
ARM Cortex-A7, A8, A9, A15, A53, A72;
ARM Cortex-M0, M0+, M3, M4, M7;
8 and 16-bit microcontrollers

Circuitries and Interfaces Power: Power management; Reverse voltage protection; ESD and transient protection; Power Isolation; Power over Ethernet; Design for Industrial 
Applications which require high product quality and system reliability.
Memory and Storage: SSD, SATA, Nor-Flash, Nand-Flash, SPI-Flash, SDRAM, DDR4, SD/SDIO/MMC
Multimedia: Audio, Video, Camera
Connectivity: USB, Ethernet, CAN, Bluetooth, WiFi, PCle, SATA
Serial: UART, SPI, I2C GPIO, A/D, D/A, and analog
Sensors: magnetometers; Accelerometers; IR-thermopiles; humidity, light and other sensors
Embedded Vision: CMOS sensors and other digital camera technology

Schematic Capture
Low EMI Design
Advanced Power management
Junction temperature sensing and thermal management

PCB Layout
Mixed speed and signal technology
High-speed digital and analog design
Low EMI/RFI design
μBGA, dual-die, fine pitch, PoP (package-on-package), microvias PCB technology, passive components as small as 01005 inch (0402 metric) packaging
Power rail separation, Power over Hours (PoH) analysis
High-density, multi-layer (12+), small form factor PCBs
Signal integrity analysis
3D modeling

Design Tools
Cadence (OrCAD Capture and Allegro)
Altium Designer/Protel
SolidWorks 3D
Re-usable schematic blocks, including layout stack-ups, to accelerate hardware design

In-House Engineering and Manufacturing Symbiosis
Design For Manufacturability (DFM) and Design For Test (DFT) optimization through close engineering and manufacturing collaboration
Component engineers select materials according to DfM principles, longevity, availability, reliability, cost, process and supply chain considerations
Rapid Prototyping, Customization, Design Iterations

Extensive Design Verification
Voltage, Current, Power, Timing, Signal Integrity and EMI Measurement
Functional Operation
Temp Chamber Stability Testing
PCBA Microsection Analysis including PCB stack-up, solder mask and cross sectional metallographic and microscopic examination
Stress testing for revealing of product failure modes
Radiated Emission, Conducted Emissions and Radiated Immunity Testing in compliance with FCC Part 15, EN55011, EN55022, CISPR11, CISPR22,
and CISPR32

Hardware design practices that incorporate testability features in PCBA design: JTAG, voltage, current, and signal test points